Advanced Substrate/PCB technology Expert
Core
Developing and enabling advanced substrate and PCB technologies for high-layer-count, ultra-large-size applications including CoWoP and DCAI, while managing vendor bring-up and technology unification.
Role type
Advanced Substrate/PCB technology Expert
Builds
3D, 3.5D & e-IVR technology enabling blocks, CPC/CPO technology building blocks, and ultra-large-size PCBs.
Domain
Semiconductor packaging and advanced PCB manufacturing
Deliverable
product features
Required skills
Vendor management, troubleshooting, technology development, DRM ownership, high-layer-count PCB design, 3D/3.5D/e-IVR technology enabling
Preferred skills
None stated
Technologies
CoWoP, DCAI, 3D, 3.5D, e-IVR, CPC, CPO
Responsibilities
New SBT vendor bring up and YIP, troubleshooting and Ops, 3D/3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development, Common strip format unification management, Advanced PCB Ultra-Large size development, PCB technology development and DRM owner
Seniority
None stated
