Memory Packaging Engineer
Core
Lead the development of cutting-edge 2.5D/3D packaging and memory subsystem solutions for Datacenter, HPC, AI, and Automotive business units.
Role type
Senior IC memory packaging technical leader
Builds
Memory subsystems (HBM, cHBM, LPDDR, IPM) for Datacenter, HPC, AI, and Automotive applications
Domain
Semiconductor packaging and memory subsystems
Deliverable
production ML models | product features | infrastructure
Required skills
Memory roadmap development, package integration planning, supply chain management, third-party vendor management, material selection, BOM optimization, cross-functional technical coordination, project progress monitoring, manufacturing metrics analysis
Preferred skills
Strategic thinking, customer obsession, deep technical expertise in advanced packaging technologies
Technologies
HBM, cHBM, LPDDR, In Package Memory (IPM), 2.5D/3D packaging
Responsibilities
Lead memory roadmap development and package integration plan; Establish and manage relationships with memory vendors; Drive material selection and BOM optimization; Monitor and report project progress, supply chain performance, and manufacturing metrics; Collaborate with IP, ASIC design, package design, Signal Integrity, Power Integrity, Thermal, and Test Engineering teams
Seniority
Senior, hands-on IC with strategic leadership