Advanced Optical Packaging Design Tech Lead
Core
Define, develop, and deliver advanced optical packaging architectures for next-generation optical engines, silicon photonics products, and co-packaged optics platforms.
Role type
Technical Lead for Advanced Optical Packaging Design
Builds
Scalable, manufacturable optical engines, silicon photonics assemblies, and co-packaged optics platforms
Domain
Semiconductor manufacturing, Silicon Photonics, Advanced Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Substrate and packaging technologies, Hybrid bonding, Thermo-mechanical behavior analysis, High-speed interconnect design, Warpage risk management, Signal integrity strategy, Cross-functional execution, Design methodology definition, Root-cause analysis, Technical mentorship
Preferred skills
None stated
Technologies
None explicitly listed (focus on physical design and processes)
Responsibilities
Define package architecture and technology direction for advanced optical and optoelectronic products; Lead design and optimization of substrate design including stack-up definition and routing topology; Drive optical, electrical, mechanical, and thermal co-design across package development; Lead development and integration of hybrid bonding solutions; Establish design methodology for warpage analysis and thermo-mechanical modeling; Own signal integrity strategy for high-speed package and substrate interconnects; Define package design rules and integration guidelines; Partner with PIC, IC, systems, and manufacturing teams to close design tradeoffs; Work with OSATs, foundries, and suppliers to enable scalable packaging solutions; Lead root-cause analysis of package performance and yield issues; Mentor engineers across disciplines.
Seniority
Senior, hands-on IC with technical leadership
