Senior Optical Packaging & Assembly Engineer
Core
Developing high-performance, robust, and scalable opto-electronic packaging workflows for chip-based photonic integrated circuits.
Role type
Senior Optical Packaging & Assembly Engineer
Builds
Scalable fibre-to-chip packaging flows and processes for photonic integrated circuits
Domain
Silicon photonics / Quantum computing hardware
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Optical fiber handling, FAU (fiber array to chip) attachment, optical measurements, optical data analysis, BOM review, supply chain coordination, vendor management, scalable assembly design
Preferred skills
None stated
Technologies
None stated
Responsibilities
Develop optical package and fibre-to-chip alignment schemes; Develop packaging prototypes and scalable assembly flows; Review packaging design BOMs and coordinate with supply chain; Transfer and scale packaging designs with internal and external teams; Source materials and provide feedback on evolving requirements; Develop advanced opto-electronic packaging solutions with external partners
Seniority
Senior, hands-on IC