Associate Process Engineer
Core
Assisting in module assembly processes and maintenance of back-end semiconductor packaging equipment for silicon photonics systems.
Role type
Associate Process Engineer (semiconductor packaging)
Builds
Electro-optical devices and subassemblies for cryogenic and room temperature vacuum systems
Domain
Semiconductor manufacturing / Silicon photonics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
die attach, wire-bonding, visual inspection, opto-mechanical assembly, semiconductor packaging equipment operation, troubleshooting assembly equipment, data processing tools (Python, JMP), process documentation
Preferred skills
familiarity with flip chip, underfill, optical coupling, quality systems, cross-functional collaboration
Technologies
Python, JMP
Responsibilities
Fabricate and assemble electro-optical devices; co-design and co-develop assembly process flow; lead and manage assembly and testing tools; develop and implement best practices; conduct complex troubleshooting and analysis; document processes and lessons learned
Seniority
Associate, hands-on IC