Package Architect – Advanced Packaging & System Exploration
Core
Define and explore advanced package architectures for future memory systems, performing trade-off studies and creating hands-on designs for early feasibility analysis.
Role type
Senior IC package architect (advanced packaging & system exploration)
Builds
Early-phase package concepts and architectural direction for future memory and system products
Domain
Semiconductor memory and storage (advanced packaging)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
package design, package-level simulation, SI modeling and analysis, thermal simulation, system-level co-design, multi-die integration, heterogeneous integration
Preferred skills
Master's degree in technical field, pre-silicon exploration experience, system-level co-design across silicon/package/board
Technologies
SI/PI simulation tools, thermal simulation tools
Responsibilities
Define and explore advanced package architectures for future memory systems; Perform package-level trade-off studies across SI, PI, thermals, cost, and scalability; Create hands-on package designs and models for early feasibility analysis; Run SI/PI and thermal simulations and translate results into architecture guidance; Define package requirements and act as extension architecture and engineering
Seniority
Senior, hands-on IC
