Senior Materials Engineer / Scientist
Core
Define and enable the materials foundation for next-generation memory and advanced packaging technologies (HBM, 3D memory, heterogeneous integration) by developing, characterizing, qualifying, and integrating new materials.
Role type
Senior IC materials scientist/engineer (advanced packaging)
Builds
Next-gen memory and packaging architectures (HBM, 3D memory, heterogeneous integration)
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Materials science fundamentals, experimental design, data analysis, hypothesis testing, cross-functional collaboration, technical communication, independent problem solving
Preferred skills
PhD in relevant field, full lifecycle material implementation, patent/publication history, supplier/lab partnership experience, semiconductor/microelectronics background, polymer encapsulation expertise, AI-enabled modeling experience
Technologies
Modeling, simulation, data analytics, AI tools
Responsibilities
Develop, characterize, qualify, and integrate advanced materials for memory and packaging; Design and run rigorous experiments to guide technology decisions; Investigate materials behavior (interfaces, adhesion, thermal, chemical); Partner with process, integration, and manufacturing teams to move materials to production; Evaluate new materials technologies with external partners; Contribute invention disclosures and patents.
Seniority
Senior, hands-on IC