Process Engineer 5
Core
Develop and optimize advanced etch processes for specialty semiconductor and advanced packaging applications to enable next-generation technologies like 3D integration and HBM.
Role type
Senior IC process engineer (semiconductor etch)
Builds
Advanced etch solutions for specialty semiconductor and advanced packaging applications
Domain
Semiconductor manufacturing / Plasma processing
Required skills
Semiconductor process development, Plasma physics, Reactive Ion Etching (RIE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP), Design of Experiments (DOE), Statistical analysis, Materials characterization, Cross-functional collaboration
Preferred skills
Advanced packaging technologies, Frame-form plasma dicing, Deep silicon etch, TSV, HBM, 3D integration, Material synthesis, Surface modification
Technologies
RIE, ICP, CCP, Wafer handling systems, DOE
Responsibilities
Develop and optimize advanced etch processes, Design and analyze experiments to improve yield and productivity, Define process and hardware requirements, Analyze data to establish robust process windows, Plan and present customer demonstrations, Collaborate on technology roadmaps, Drive technology adoption at customer sites
Seniority
Senior, hands-on IC