Process Engineer 5 (Advanced Packaging Integration Technologist)
Core
Lead complex joint development projects (JDPs) and research programs to drive advanced packaging integration solutions for heterogeneous integration product roadmaps.
Role type
Senior IC process integration technologist (advanced packaging)
Builds
Integrated test vehicles, process integration flows, and novel technology development options for logic and memory products
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Advanced packaging integration (2D/2.5D/3D, WLP, HBM), process flow synthesis, test vehicle development, system-level co-optimization, root-cause analysis, program management, statistical data analysis, AI tool utilization
Preferred skills
Joint development project initiation, research institute collaboration, market assessment, competitive intelligence
Technologies
TSV, WLP, HBM, panel level packaging, AI tools, statistical analysis software
Responsibilities
Synthesize customer roadmap needs and propose solution paths for product performance and yield; Engage with engineering and account teams on test vehicle needs; Study system-level co-optimization trends and identify critical hardware/process needs; Design experiments and lead data analysis to resolve process integration problems; Develop JDP scope, objectives, KPIs, and milestones; Lead collaborations with peers, partners, and startups to implement co-optimized strategies; Represent the company at industry conferences; Support mentoring and recruitment for the ecosystem team
Seniority
Senior, hands-on IC with program management