Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Core
Develop and optimize assembly processes for advanced packaging technologies (wafer-level packaging, die stacking) to enable high-performance memory products like HBM for AI applications.
Role type
Principal/Staff Engineer, Advanced Packaging Process Development
Builds
High-bandwidth memory (HBM) packages and advanced packaging solutions for AI compute and memory markets
Domain
Semiconductor manufacturing, Advanced Packaging, AI Hardware (via careerplan.io/jobs/38194281-principalstaff-engineer-engineer-aptd-cem-advanced-packaging-die-level-technology-engineer)
Required skills
Semiconductor process development, Wafer bonding, Die stacking, Python, R, SQL, Statistical analysis, Process modeling, Data analytics, SPC, DOE, Defect analysis, Visual Basic, Equipment evaluation, Materials evaluation
Preferred skills
Experience with E3, FDC, RMS, Yield improvement, Cost reduction, Cross-functional collaboration
Technologies
Python, R, SQL, Visual Basic, E3, FDC, RMS
Responsibilities
Develop and optimize assembly processes for advanced packaging technologies; Evaluate and promote new equipment and materials; Ensure defense coverage through process, measurement, inspection, and testing; Work with stakeholders to integrate manufacturing processes; Provide Process of Record (POR) and Model of Record (MOR) documentation; Integrate AI-assisted tools to improve efficiency and quality.
Seniority
Principal/Staff, hands-on IC with strategic coordination