Director – Package Materials Integration, APTD
Core
Lead the strategy and execution of the advanced packaging materials roadmap for 3D memory products including HBM and 3DS DRAM, managing a global team and driving supplier engagement.
Role type
Director, Advanced Packaging Materials Integration
Builds
Advanced 3D memory products (HBM, 3DS DRAM) and novel materials solutions
Domain
Semiconductor manufacturing / Advanced Packaging / Materials Science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Strategic roadmap planning, global team leadership, supplier engagement at executive levels, materials characterization strategies, simulation methodologies (thermal/mechanical/electrical), cross-functional program execution, talent development across geographies
Preferred skills
Experience with advanced memory packaging, deep knowledge of 2.5D/3D heterogeneous integration technologies
Technologies
WLFO, SoIC, CoWoS, WoW, InFO, chiplet/SiP architectures, wafer bumping, package assembly, substrate technology
Responsibilities
Lead the advanced packaging materials roadmap aligned with product timelines; Provide organizational leadership for a diverse materials portfolio (chemistries, photoresists, films, polymer composites, carrier materials); Lead supplier engagement to prototype, develop, and certify materials; Build and lead a high-performing global team with direct reports in the U.S. and Asia; Partner with process engineering and integration leaders to ensure TD deliverables; Drive materials characterization strategies to understand materials-package interactions; Lead development of novel materials solutions meeting electrical, mechanical, thermal, and reliability requirements; Interface with Product Development, frontend Si TD, APTD, Manufacturing, and Global Quality to lead the product/package path.
Seniority
Director, global team leadership