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Staff HBM Design Architect - DFT

2 Locations💼 Full-time💰 $146,000–$146,000🗓 2026-05-13 → 2026-08-01

Core

Define and implement end-to-end DFT architectures for HBM base die and DRAM die to ensure quality, yield, and performance across complex multi-die architectures.

Role type

Staff HBM Design Architect (DFT)

Builds

Test architectures for next-generation HBM products

Domain

Semiconductor memory (HBM/DRAM) and 3D-stacked integration

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> infrastructure (test flows, access mechanisms)

Required skills

DFT architecture design, scan/MBIST/JTAG/boundary scan concepts, wafer probe and final test semiconductor flows, multi-die architecture testing

Preferred skills

HBM/DRAM/advanced memory product experience, TSV-based 3D integration knowledge, at-speed test techniques, DFT security features

Technologies

JTAG, MBIST, TSV, wafer probe, boundary scan

Responsibilities

Define end-to-end DFT architectures for HBM and DRAM die; Develop DFT strategies for stacked-die, cube-level, and system-level test flows; Architect test access mechanisms supporting wafer probe through final test; Enable silicon observability for yield learning, debug, and failure analysis; Collaborate across design, verification, layout, test, and manufacturing teams

Seniority

Staff, hands-on IC with strategic influence

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