Silicon Packaging Design Engineer
Core
Define packaging solutions for highly innovative integrated circuits, optimizing mechanical, thermal, and electrical performance to achieve lowest package and system level cost.
Role type
Senior IC packaging design engineer
Builds
Custom lead frame/substrate/module packaging solutions for integrated circuits
Domain
Semiconductor manufacturing / IC Packaging
Required skills
IC packaging design and layout, Siemens Xpedition EDA toolset, wafer bumping, substrate and lead frame manufacturing, wire bond and flip chip assembly, electrical simulation, signal integrity, power integrity
Preferred skills
PCB design, NPI management
Technologies
Siemens Xpedition
Responsibilities
Co-design with chip designer, system engineering and PCB design teams to optimize pad layout and pin map; Plan, design and develop quality custom lead frame/substrate/module with supporting electrical simulation; Act as technical lead for implementing packaging solutions at OSAT assembly site; Prepare assembly site readiness for continuous uninterrupted flow from wafer fab-out to quality packaged sample; Maintain complete set of product specific packaging related drawings, and reports.
Seniority
Senior, hands-on IC
