Silicon Packaging Design Architect
Core
Design end-to-end silicon package solutions meeting physical, electrical, thermal, and cost requirements for Intel's advanced packaging technologies.
Role type
Senior Silicon Packaging Design Architect
Builds
Advanced silicon packages and 3D IC designs
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Semiconductor fabrication, chip assembly, packaging design, electromagnetic simulation, PCB layout, assembly processes, test methodologies, technology tradeoffs, EDA tools, cross-functional collaboration
Preferred skills
TS/SCI security clearance, 10+ years in package/PCB/IC design, cost optimization, complex issue resolution, multidisciplinary team leadership
Technologies
Mentor, Cadence, SPICE, Ansys, Allegro, Xpedition, Hyperlynx, Sigrity, Concept HDL, APD/SiP
Responsibilities
Translate product requirements into package architecture specifications; drive technology tradeoff decisions for electrical/mechanical/thermal/reliability standards; oversee end-to-end package development; troubleshoot designs and resolve material/process issues; implement co-design strategies between silicon and board teams; collaborate with EDA partners to advance design tools.
Seniority
Senior, hands-on IC
