Packaging Module Development Engineer
Core
Develop and qualify advanced packaging processes, materials, and equipment for high-volume manufacturing to support Intel's heterogeneous integration and die disaggregation solutions.
Role type
Entry-level packaging module development engineer
Builds
Advanced semiconductor packaging processes and equipment
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Design of Experiments (DOE), Statistical Process Control (SPC), process qualification, equipment setup and calibration, process data analysis, quality systems knowledge, technical documentation
Preferred skills
Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or Chemistry background; semiconductor device fabrication process flows; complex technical project management; innovation and optimization focus
Technologies
Semiconductor packaging equipment, manufacturing systems
Responsibilities
Develop and qualify advanced packaging processes and materials; Design and implement process specifications and prototype workflows; Conduct Design of Experiments to analyze process windows; Drive continuous process improvements; Collaborate with cross-functional teams to resolve technical challenges; Establish material specifications and partner with suppliers; Document technical findings and process innovations; Support standardization of manufacturing systems; Provide sustaining support for equipment performance
Seniority
Entry-level, hands-on IC
