ENGR II, PROCESS; MFG
Core
Develop and execute experiments to create new technology platforms for intelligent power and sensing technologies, integrating wafer technologies into final package and assembly processes.
Role type
Process Engineer (Semiconductor Manufacturing)
Builds
Next-generation semiconductor technologies and integrated packaging solutions
Domain
Semiconductor manufacturing, automotive, industrial automation
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor processing experience, wafer thinning, metal deposition, materials knowledge, packaging knowledge, statistical analysis, FMEA risk analysis, data analysis (Excel/JMP), Microsoft Office proficiency
Preferred skills
MS degree, experience in sputter/plating/photolithography/wafer bonding, cross-functional team collaboration
Technologies
JMP, Excel, Microsoft PowerPoint, 300mm wafer thinning equipment
Responsibilities
Support development and execution of experiments to create new technology platforms, work with East Fishkill Post FAB team and cross-functional teams to implement processes into manufacturing, enhance technical skills in wafer thinning, metal deposition, materials, and packaging, understand development strategy and convert to actionable goals, learn and implement statistical analysis in the development of new processes, assist in driving accountability throughout team to meet metrics, deliver processes and metrics towards meeting project goals and timelines, support Package Development Teams and customers with process integration, data analytics and reports
Seniority
Individual Contributor, mid-level