Package Development/NPI Engineer
Core
Drive advanced semiconductor packaging technologies from initial development through mass production for automotive, datacenter/HPC, and computing applications.
Role type
Package Development/NPI Engineer
Builds
Advanced packaging solutions for automotive, datacenter/HPC, and computing applications
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
NPI process management, cross-functional collaboration, technology transfer, yield improvement, production troubleshooting, prototype build execution, reliability testing, failure analysis, root cause analysis, risk assessment
Responsibilities
Lead transition of advanced packaging products from Development to MP, managing NPI process, qualification, and production ramp-up; Collaborate with internal cross-functional partners to define product requirements and execute MP readiness plans; Manage technology transfer, yield improvement, and production issue troubleshooting with external partners; Support and execute prototype builds, product qualification, reliability testing, and failure analysis; Lead risk assessment and technical reviews during product ramps; Ensure all deliverables and milestones for NPI to MP are met with high quality and on schedule.