Process Engineer
Core
Developing next-generation semiconductor technologies and integrating wafer processes into final packaging and assembly.
Role type
Process Engineer (Semiconductor)
Builds
Next-generation technology platforms and integrated wafer/package processes
Domain
Semiconductor manufacturing (wafer processing, packaging, assembly)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor processing experience, 300mm wafer thinning, metal deposition, materials knowledge, packaging knowledge, statistical analysis, FMEA risk analysis, data analysis (Excel/JMP), cross-functional collaboration
Preferred skills
MS degree, sputter, plating, photolithography, wafer bonding experience
Technologies
JMP, Excel, PowerPoint
Responsibilities
Support development and execution of experiments for new technology platforms, implement processes into manufacturing with East Fishkill Post FAB team, enhance technical skills in wafer thinning and deposition, convert development strategy to actionable goals, implement statistical analysis for process development, drive team accountability to meet metrics, deliver processes and metrics towards project goals, support Package Development Teams with process integration and data analytics
Seniority
Individual Contributor