Advanced Packaging Integration and Simulation Intern
Core
Develop and assess next-generation semiconductor package architectures through process integration, simulation modeling, and data analytics to enable high-performance computing and AI systems.
Role type
Advanced Packaging Integration and Simulation Intern
Builds
Next-generation package architectures, 2.5D/3D integration modules, and hybrid bonding solutions
Domain
Semiconductor manufacturing / Advanced packaging / High-performance computing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE design and execution, thermo-mechanical simulation, Python/MATLAB/R programming, statistical analysis, engineering data analysis, process integration workflows
Preferred skills
Finite element analysis, failure analysis for semiconductor packages, thermal/mechanical/electrical modeling, chiplet integration, wafer-level packaging
Technologies
Python, MATLAB, JMP, R, FEA tools
Responsibilities
Support wafer-level and package-level process flows including 2.5D/3D integration and hybrid bonding; Build, calibrate, and apply simulation models for mechanical, thermal, and interconnect performance; Analyze inspection and simulation data to identify root causes of integration challenges; Collaborate with cross-functional teams to optimize process flows for yield and reliability; Present findings through technical presentations and publications.
Seniority
Intern, research and development
