Process Integration, Yield and Defect Reduction Engineering Lead
Core
Lead Process Integration (PI) teams to support the transfer, ramp, and sustainment of advanced packaging technologies at Intel's New Mexico manufacturing site.
Role type
Senior IC Process Integration Engineering Lead (Advanced Packaging)
Builds
Advanced packaging manufacturing operations and foundry customer commitments
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | infrastructure
Required skills
Process integration, Defect reduction, Design of Experiments (DOE), Statistical process control, Data analysis, Yield analysis, Failure Modes and Effects Analysis (FMEA), Inline monitoring systems, Manufacturing health metrics, Technology transfer
Preferred skills
Process capability analysis, Specification management, Statistical variation, Cross-functional team leadership, Operational excellence
Technologies
JMP, SQL, PCS
Responsibilities
Collaborate with HVM engineering and factory operations to support technology transfer and ramp; Analyze defectivity and parametric data to identify yield limiters; Lead technology development, transfer, and manufacturing ramp activities; Develop inline monitoring systems and manufacturing health metrics; Drive continuous improvements in yield, quality, reliability, and manufacturing efficiency.
Seniority
Senior, hands-on IC with leadership responsibilities
