External Manufacturing NPI Engineer
Core
Lead backend external manufacturing New Product Introduction (NPI) from conceptualization through production launch for semiconductor packages.
Role type
Senior IC Manufacturing NPI Engineer
Builds
New semiconductor package platforms and complex derivative platforms
Domain
Semiconductor manufacturing (backend), IC packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor assembly process expertise, DFM analysis, production ramp management, cross-functional team leadership, statistical analysis methods, DOE characterization, SPC, failure analysis, project management
Preferred skills
Wafer-level packaging (WLP) experience, bumping technology, electroless & electrolytic plating, Chip-to-Package Interaction (CPI) knowledge, SiC/GaN/CIS Imaging experience
Technologies
PLM systems, data analytics tools
Responsibilities
Interface and steer cross-functional engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain, and Procurement; Partner with OSATs to deliver assembly readiness including process flow setup, risk analysis, and qualification; Manage production ramp including safe launch, technical support, and transition to high-volume manufacturing; Establish Best Known Methods and drive continuous yield improvement; Participate in quality and process readiness audits.
Seniority
Senior, hands-on IC