Process Engineer Section Manager
Core
Lead and develop the FOL Process Engineering organization to ensure stable yield, high equipment capability, and adherence to customer/reliability requirements for semiconductor assembly.
Role type
Senior IC process engineering manager (semiconductor assembly)
Builds
FOL packages (SPC governance, PFMEA/Control Plan, recipe management, process capability Ppk, documentation)
Domain
Semiconductor manufacturing / Electronics assembly
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
FOL process mastery (Die Attach, Wire Bond, Clip Attach, Plasma), yield improvement, DOE, SPC, PFMEA/Control Plan, equipment/materials qualification, 8D/DMAIC problem-solving, audit readiness (IATF/ISO)
Preferred skills
Technical talent development, cross-functional alignment, high-volume/high-complexity environment management
Technologies
Minitab, Exensio, SPC tools
Responsibilities
Provide strategic process ownership for all FOL Package Group; Lead engineering responses to yield losses, defect contributors, and reliability audit failures; Oversee execution of Continuous Improvement Plan and productivity projects; Ensure audit readiness and compliance to change control; Develop technical talent and balance engineering workload
Seniority
Senior, hands-on IC with leadership