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Device Engineer

Aizuwakamatsu-Shi, Fukushima, Japan💼 Full-time🗓 2026-06-26 → 2026-07-22

Core

Technology owner for Analog IC processes in an 8-inch wafer fabrication facility, driving development, manufacturing excellence, and yield improvement.

Role type

Senior Device/Process Integration Engineer

Builds

Analog IC products and processes for mass production

Domain

Semiconductor manufacturing (front-end), Analog IC

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Device physics, IC process knowledge, analog circuit design, reliability engineering, root cause analysis, data analysis (yield/defect), cross-functional project leadership, risk management (8D, FTA, Why-Why), manufacturing condition management (Control Plans, FMEA, SPC)

Preferred skills

New technology development/transfer, semiconductor circuit design, device simulation, test development, front-end equipment operation, AI-driven process optimization

Technologies

8-inch wafer fab equipment, SPC tools, FMEA/8D/FTA methodologies

Responsibilities

Lead development and transfer projects for new technologies and products; improve product quality and yield through process design and optimization; drive continuous improvement of quality, yield, and reliability for mass production products; manage manufacturing conditions (Control Plans, FMEA, SPC); perform root cause analysis and implement corrective actions for yield loss or performance issues

Seniority

Senior, hands-on IC

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