EMIB-T Substrate Yield Lead
Core
Lead end-to-end substrate yield performance for EMIB-T technology development and manufacturing readiness, driving defect reduction and process optimization.
Role type
Senior IC yield engineering lead (advanced packaging)
Builds
Next-generation heterogeneous integration platforms (EMIB-T) for Intel Foundry Services and Product Groups
Domain
Semiconductor manufacturing / Advanced packaging / Materials Science
Deliverable
production ML models | product features
Required skills
Statistical analysis, Defect metrology, Failure analysis, SPC, DFM/DFY, Process optimization, Yield engineering, Computer vision, AI/ML defect detection, Automated defect classification
Preferred skills
Substrate supplier management, Program leadership, 2.5D/3D integration expertise, Technology ramp experience
Technologies
Automated analytics, Dashboards, Computer vision, AI/ML
Responsibilities
Own end-to-end substrate yield performance, Drive DFM/DFY engagement and defect pareto closure, Lead daily yield huddles and cross-functional reviews, Identify and drive closure of critical yield and reliability issues, Partner with substrate suppliers and integration teams, Define and scale yield intelligence infrastructure
Seniority
Senior, hands-on IC
