Engineer, APTD CEM - Advanced Packaging Integration Engineering
Core
Develop and enable advanced package technology for post-fab wafer finish and assembly processes, focusing on yield improvement, cost reduction, and quality control for semiconductor manufacturing.
Role type
Senior IC Advanced Packaging Integration Engineer
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Semiconductor process integration, Yield analysis, Statistical data analysis, Process modeling, Manufacturing transition management, Documentation (POR/MOR), Cross-functional collaboration
Preferred skills
Python, R, SQL, Visual Basic for automation, Semiconductor industry experience, Leadership track record