Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)
Core
Develop and enable innovative inspection and metrology techniques for advanced packaging technologies, specifically High Bandwidth Memory (HBM), to drive yield breakthroughs and process efficiency.
Role type
Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)
Builds
Advanced packaging solutions for high-performance memory products (HBM)
Domain
Semiconductor manufacturing / Advanced Packaging / Metrology
Deliverable
production ML models (via careerplan.io/jobs/38194866-principalsenior-engineer-advanced-package-metrology-real-time-defect-analysis-mrda-at-micr)
Required skills
Python, R, SQL, Visual Basic, E3, FDC, RMS, SPC, DOE, defect analysis, wafer/assembly tools operation, process modeling, statistical analysis
Preferred skills
Experience in wafer bonding, plating, warpage control, AI-assisted tool integration
Technologies
Power BI, E3, FDC, RMS, Visual Basic
Responsibilities
Develop and optimize metrology recipes for semiconductor processes; Establish inspection methodologies and best-known methods (BKM); Perform in-line characterization and validation of metrology recipes; Utilize data analysis tools to summarize recipe status and project progress; Own and manage metrology tools to meet performance indicators; Integrate AI-assisted tools to improve efficiency and quality; Collaborate with cross-functional teams (Package Integration, Front End Wafer Fab, Assembly/Test Engineering) to integrate manufacturing processes
Seniority
Principal/Senior, hands-on IC