Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering
Core
Develop and enable advanced semiconductor packaging technologies for high-performance memory products (HBM), focusing on post-fab wafer finish and assembly processes to drive yield, quality, and manufacturability.
Role type
Principal/Senior IC Advanced Packaging Integration Engineer
Builds
High-bandwidth memory (HBM) packages and advanced integration flows for data center and AI applications
Domain
Semiconductor manufacturing / Advanced Packaging / Memory Technology
Required skills
Semiconductor process integration, Python, R, SQL, Statistical Process Control (SPC), Design of Experiments (DOE), Yield analysis, Data analytics, Visual Basic automation, E3/FDC/RMS systems, Cross-functional collaboration (via careerplan.io/jobs/38194937-principalsenior-engineer-aptd-cem-advanced-packaging-integration-engineering-at-micron)
Preferred skills
PhD in EE/Materials/ChemE/Physics, Experience with post-fab assembly, AI tool literacy
Technologies
Python, R, SQL, Visual Basic, E3, FDC, RMS, SPC tools, DOE software
Responsibilities
Develop advanced package technology for post-fab wafer finish and assembly; Diagnose and propose yield-related breakthroughs; Integrate semiconductors with process and product engineering teams; Analyze data to drive layout, design, or integration flow changes; Ensure defense coverage through process, measurement, inspection, and testing; Coordinate technology development strategies with internal and external stakeholders; Provide Process Of Record (POR) and Model Of Record (MOR) documentation for production transfer
Seniority
Senior, hands-on IC with strategic coordination