High Volume Manufacturing Engineer
Core
Guide manufacturing at OSATs and drive industry-leading products from pre-si readiness through post-si bring-up and high-volume manufacturing (HVM) for 2.5D/3D IC and sub-3nm nodes.
Role type
Senior IC manufacturing engineer (silicon bring-up & HVM)
Builds
Production silicon and package reliability qualification, post-silicon manufacturing test flow, and yield improvement strategies for CPU/GPU/SoC products.
Domain
Semiconductor manufacturing, advanced packaging (2.5D/3D IC), sub-3nm nodes
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CPU/SOC/GPU silicon bring-up, manufacturing test, yield improvement, silicon characterization, reliability qualification, structural/functional test concepts, DFT/SW diagnostics, device physics, foundry/assembly processes
Preferred skills
SOC Design, yield analysis, software scripting
Technologies
Silicon.da, Optimal+, JMP, data log parsing scripts
Responsibilities
Align multi-functionally with design, packaging, software, silicon validation, characterization, test, and quality teams; enhance yield and characterization methodologies using integrated sensor frameworks; own post-silicon manufacturing test flow and electrical failure analysis; drive execution of manufacturing flows at OSATs.
Seniority
Senior, hands-on IC