Front End Central Product Integration Senior / Staff / Principal / Engineer, Test & Product Yield Integration
Core
Lead global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products by synthesizing project information from multiple global teams.
Role type
Senior IC semiconductor product integration engineer (yield & test)
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing (DRAM, NAND, NOR) and advanced packaging
Required skills
Semiconductor device physics, DRAM product operations, wafer fabrication process flows, parametric/electrical testing, probe yield, data analysis, debugging, troubleshooting, problem-solving
Preferred skills
DRAM High Bandwidth Memory (HBM) products, DRAM HPM, advanced packaging, chip-package interaction, BEOL integration, layout-related topics
Technologies
Microsoft Office
Responsibilities
Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance; Centralize and synthesize project information from multiple global teams; Drive yield breakthroughs by understanding end-to-end test flow, product design, and manufacturing processes; Foster technical innovation by characterizing device failure modes; Define and drive strategies for Packaging Technology and Chip-Package Interaction; Lead cross-site taskforces to resolve yield and quality challenges; Promote network Best-Known-Method development and standardization.
Seniority
Senior, hands-on IC