Foveros Direct Pathfinding Integration
Core
Design, develop, and qualify packaging solutions and materials for semiconductor products, managing the end-to-end packaging development process from concept to manufacturing startup.
Role type
Senior packaging engineering lead (semiconductor)
Builds
Semiconductor packaging solutions and materials for compute devices
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
packaging engineering, process development, technology innovation, thermal design, mechanical design, electrical design, qualification testing, specification documentation, packaging material certification
Preferred skills
advanced packaging technology development, strategic supplier management, hybrid bonding process development, cross-functional stakeholder engagement, defect reduction process improvements
Technologies
semiconductor packaging materials, hybrid bonding processes
Responsibilities
Design and qualify packaging solutions and materials; manage packaging development lifecycle including artwork, prototypes, and testing; consult on product launch, branding, SKU, barcodes, labeling, and supply chain logistics; drive efficiency, cost, manufacturability, and sustainability improvements in packaging processes
Seniority
Senior, hands-on IC