Senior IC Packaging Engineer
Core
Provide expertise and support for the design, implementation, and qualification of custom Silicon devices and advanced 2.5D/3D packaging solutions for Azure datacenter products.
Role type
Senior IC Packaging Engineer
Builds
Custom Silicon devices, 2.5D/3D packaging products (bridge/interposer/substrate), and test vehicles.
Domain
Semiconductor manufacturing and advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced semiconductor package technologies (BGA/2.5D/3D), IC package or PCB board layout CAD tools (Cadence Allegro), high-speed signaling and thermal co-design, 2D/3D simulation tools, OSAT/Supplier/Foundry technologies, physical failure analysis, supplier management
Preferred skills
Experience in semiconductor package product development, manufacturing, supplier management, or quality management
Technologies
Cadence Allegro, 2.5D/3D packaging tools
Responsibilities
Support design and implementation of new custom Silicon devices, evaluate and recommend new packaging technology, provide substrate design support, conduct device/package qualification, assess and manage suppliers through development to production, drive quality/reliability, develop FMEA for technology options, define EDA tool requirements, design package and assembly drawings for manufacturing, define and develop test vehicles to validate performance
Seniority
Senior, hands-on IC
