Package Design Rule Owner (DRO)
Core
Define, validate, and deploy design rules for package substrate design to enable competitive product designs meeting cost and manufacturability requirements.
Role type
Package Design Rule Owner (DRO)
Builds
Package substrate designs for advanced semiconductor product families
Domain
Semiconductor fabrication and advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> infrastructure (design rule sets and substrate specifications)
Required skills
semiconductor fabrication processes, packaging technologies, package substrate physical design, thermo-mechanical performance, electrical performance, substrate manufacturing, assembly processes
Preferred skills
advanced packaging architectures (EMIB, Foveros), analytical problem-solving, debugging, independent work, organization, time management
Technologies
EMIB, Foveros
Responsibilities
Collaborate with product design, substrate manufacturing, and package assembly to drive design rules; work from technology concept through product design tape out; develop consistent Design Rule strategy and roadmap; interface with product designers and external suppliers/customers
Seniority
Senior, hands-on IC
