Electromechanical Packaging Engineer
Core
Designing chip scale packaging and HDI organic substrate layouts for integrated voltage regulator products to optimize power delivery and efficiency.
Role type
Electromechanical Packaging Engineer
Builds
Integrated voltage regulator products
Domain
Power management / Microelectronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
microelectronics packaging, PCB design, 3D mechanical CAD (Creo, NX, Catia), GD&T, electrical schematics, foundry processes, chip scale assembly, DFM
Preferred skills
PCB design tools (Altium, Cadence, Mentor), component level thermal analysis
Technologies
Creo, NX, Catia, Altium, Cadence, Mentor
Responsibilities
Support chip scale packaging design and HDI organic substrate layout; Collaborate with substrate layout, ASIC design, and manufacturing engineers; Create mechanical drawings for substrate fabrication and packaged part assembly; Work with vendors for components, assembly, and test
Seniority
Mid-Senior, hands-on IC
