CareerPlanGet AI match score →

Electromechanical Packaging Engineer

RCP LA (Torrance, CA)💼 Full-time💰 $150,000–$150,000🗓 2026-06-30 → 2026-07-31

Core

Design chip scale packaging and HDI organic substrate layouts for integrated voltage regulator products.

Role type

Electromechanical Packaging Engineer

Builds

Integrated voltage regulator products

Domain

Microelectronics packaging and PCB design

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Microelectronics packaging, PCB design, 3D mechanical CAD (Creo, NX, Catia), GD&T, electrical schematics, tape out processes, DFM

Preferred skills

Thermal analysis, PCB design tools (Altium, Cadence, Mentor)

Technologies

Creo, NX, Catia, Altium, Cadence, Mentor

Responsibilities

Support chip scale packaging design and HDI organic substrate layout, create mechanical drawings for substrate fabrication and assembly, collaborate with substrate layout, ASIC design, and manufacturing engineers, work with vendors for components, assembly, and test

Seniority

Mid-level, hands-on IC

Sourced via greenhouse · Listed on CareerPlan, which tracks 70,000+ jobs from 20+ sources.
Apply on Greenhouse ↗