Packaging Design Integration Engineer (2026 New College Graduate)
Core
Support chip package co-design activities for electro-optical transceivers using Photonix platform and advanced 2.5D/3D packaging technologies.
Role type
New College Graduate Packaging Design Integration Engineer
Builds
Electro-optical transceivers using Photonix platform and advanced 2.5D/3D packaging technologies
Domain
Semiconductor manufacturing / Silicon Photonics / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thermal analysis, Mechanical analysis, Electrical analysis, Optical analysis, Design rule development, Simulation modeling, Reliability characterization, Data analysis, Cross-functional collaboration, Technical documentation
Preferred skills
HFSS, Zemax, FloTHERM, Finite element analysis, Design of Experiments (DOE), Engineering statistics, Advanced packaging technologies (flip-chip, chiplets, 2.5D, 3D integration), Project management
Technologies
Photonix platform, HFSS, Zemax, FloTHERM, Finite element analysis tools
Responsibilities
Support packaging design integration activities for silicon photonics and advanced packaging products, Assist with thermal, mechanical, electrical, and optical chip package co-design analysis, Contribute to design rule development and manufacturability assessments, Use engineering data and simulations to evaluate design options, Participate in cross-functional problem-solving for yield and reliability, Support development of design guidelines and technical reports, Collaborate with design, product, process integration, manufacturing, quality, and supplier teams
Seniority
Entry-level, New College Graduate
