MTS Package Mechanical Design
Core
Design electro-optical transceivers and advanced packaging (2.5D/3D co-packaged optics) using the Photonix platform.
Role type
Senior IC mechanical design engineer (opto-mechanical)
Builds
CPO products integrating PICs, EICs, substrates, and optical components
Domain
Semiconductor manufacturing / Photonics / Advanced Packaging
Deliverable
production ML models | product features
Required skills
CAD software (SolidWorks, Creo), mechanical engineering principles, thermal analysis, structural analysis, BOM creation, DFM/DFA, FMEA
Preferred skills
opto-mechanical design, lens mounting, optical alignment, tolerance analysis, Silicon Photonics integration, OSAT ecosystem experience
Technologies
SolidWorks, Creo, Photonix platform
Responsibilities
Create mechanical designs for CPO products; Design for manufacturability and yield; Create detailed documentation including BOMs and drawings; Collaborate with cross-functional teams (electrical, optical, process engineers); Drive product packaging design reviews and material selection; Perform continuous improvement plans (CIP)
Seniority
Senior, hands-on IC
