MTS Package Mechanical Design
Core
Design electro-optical transceivers and CPO products using GF's Photonix platform and advanced 2.5D/3D co-packaged optics form factors.
Role type
Senior IC mechanical design engineer (opto-mechanical)
Builds
Electro-optical transceivers, CPO products, and advanced packaging solutions
Domain
Semiconductor manufacturing, photonics, advanced packaging
Required skills
CAD software (SolidWorks, Creo), mechanical engineering principles, thermal analysis, structural analysis, BOM creation, design for manufacturability
Preferred skills
Opto-mechanical design, lens mounting, optical alignment, tolerance analysis, Silicon Photonics integration, photonic/electrical interconnect innovation
Technologies
SolidWorks, Creo, Photonix platform
Responsibilities
Create mechanical designs for CPO products integrating PICs, EICs, substrates, and optical components; Design for manufacturability and yield; Create detailed documentation including BOMs and drawings; Collaborate with cross-functional teams (electrical, optical, process engineers); Drive product packaging design reviews, materials selection, and FMEAs; Perform continuous improvement plans (CIP)
Seniority
Senior, hands-on IC