Hardware Engineer
Core
Design and sustain optical transceiver components and modules, transitioning Silicon Photonics products from NPI to HVM release with OSAT partners.
Role type
Senior IC Hardware Engineer (Optical Packaging & Assembly)
Builds
Optical transceiver components and modules for Cisco's next-generation product portfolio
Domain
Semiconductor manufacturing, Silicon Photonics, Optical module assembly
Required skills
Silicon Photonics wafer and chip level packaging, CoW/CoC wafer processing, OSAT supplier management, statistical process control (SYL/SBL), JMP scripting, Python, yield analysis, DFM, flip chip assembly, TSV technologies
Preferred skills
Cu micro bump processing, post CMOS back end assembly, AI models for automated yield prediction
Technologies
JMP, Python, OSAT equipment, flip chip assembly tools
Responsibilities
Transition Silicon Photonics products from NPI to HVM with OSAT partners, optimize optical packaging assembly processes to improve yield and quality, support new OSAT supplier engagement, characterize NPI product performance and yield, drive DFx for optical packaging design and assembly, monitor ETest/WAT data to resolve critical yield issues, stabilize product screening at wafer-probe and package levels
Seniority
Senior, hands-on IC
