3D-IC Methodology Architect
Core
Develop design & verification methodology for 3D-IC, heterogeneous integration, EMAG, thermal & package flows for multi-die systems.
Role type
Senior IC 3D-IC Methodology Architect
Builds
Design flows, verification methodologies, and automation features for multi-die systems
Domain
Semiconductor manufacturing, 3D-IC, heterogeneous integration, RF, AMS, silicon photonics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
3D-IC methodology design, model verification, heterogeneous integration flows, EDA tool expertise, analog/RF/AMS/digital design flows, team leadership, standards development, cross-functional collaboration, mentoring, Unix environment proficiency
Preferred skills
Java coding, genAI interest, project management, innovation in ambiguous environments
Technologies
EDA tools, Unix, Version Control systems, Configuration Management, Regression process
Responsibilities
Develop design & verification methodology for multi-die systems; Lead technical team and drive standards across organization and vendors; Partner with EDA vendors and internal PDK/design teams; Scope customer requirements and design flows adoption; Mentor and train junior engineers on software and automation features
Seniority
Senior, hands-on IC with strategic leadership
