Senior Design Automation Engineer
Core
Develop automation to enable physical design teams to execute Package and PCB products from floor planning through tape out and manufacturing release for next-generation machine learning and data center ASICs.
Role type
Senior Design Automation Engineer (Physical Design)
Builds
Production-ready Package and PCB designs for 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies.
Domain
Semiconductor hardware design, advanced packaging, and data center ASICs.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Python, Skill, TCL, physical design automation, DRC/verification integration, cross-level co-optimization, EDA tool evaluation, DFM compliance
Preferred skills
Master's or Ph.D. in Electrical Engineering, advanced packaging expertise
Technologies
Allegro, APD, 3DICC, Expedition, AI coding agents
Responsibilities
Develop and deploy efficient design methodologies for die floor planning, bump/pad assignment, RDL routing, substrate design, and tape out release; Deliver custom design automation to improve RDL and substrate routing for high-density interconnects; Contribute to cross-level teams for co-optimization across die RDL, interposer/substrate, and PCB levels; Develop data integration flows for co-design data across Package, PCB and SI/PI flows; Identify preferred methodologies to integrate physical verification checks into physical design cycles; Follow and help refine package design rules and guidelines to ensure DFM compliance; Collaborate with SI/PI engineers to incorporate electrical constraints into physical layout methodologies.
Seniority
Senior, hands-on IC
