Advanced Substrate Design & Process Integration
Core
Lead the development of next-generation substrate architecture, design rules, and technology platforms enabling AMD's future packaging solutions, focusing on design-for-manufacturability, yield, reliability, and electrical performance optimization.
Role type
Senior IC substrate design and process integration engineer
Builds
Next-gen substrate architecture, design rules, and technology platforms for AMD packaging solutions
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Substrate design architecture, process integration, design-for-manufacturability (DFM), design-for-yield (DFY), reliability engineering, signal integrity, power integrity, HDI design, advanced package substrates, design-process co-optimization, supplier technology management
Preferred skills
Chiplet architecture, 2.5D heterogeneous integration, technology roadmap development, strategic supplier partnership building
Technologies
Substrate stack-up methodologies, routing architectures, via technologies, advanced package integration tools
Responsibilities
Define substrate technology requirements and design roadmaps; Develop substrate design rules and stack-up methodologies; Lead design-process co-optimization with manufacturing partners; Drive design methodologies to maximize manufacturing yield; Lead substrate reliability strategy and design rule development; Drive substrate architecture solutions for signal and power integrity
Seniority
Senior, hands-on IC technical leader
