Staff Package Design Engineer
Core
Design and develop advanced semiconductor package and interconnect methods for high-density, high-reliability applications in AI, HPC, and power delivery markets.
Role type
Staff Package Design Engineer
Builds
Power SiP/modules, flip-chip LGA, multi-chip module, and power device packaging solutions (via careerplan.io/jobs/744000153927262-staff-package-design-engineer-at-renesas-electronics)
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Package design, interconnect methods, DOE optimization, process qualification, production transition, leadframe technology, power SiP/module design, flip-chip packaging, wafer metallization, wire-bonding, SPC, statistical analysis
Preferred skills
Experience with AutoCAD, Excel, PowerPoint, Word
Technologies
Power QFN, SiP, flip-chip, LGA, multi-chip module, wafer front-side/back-side metallization, wire-bonding, SPC
Responsibilities
Design package and interconnect methods for Power SiP/modules, flip-chip LGA, and multi-chip module; Develop and run DOEs with OSAT/CM to optimize processes; Qualify new packages and processes with Product Groups and Reliability teams; Resolve process integration issues for production transition; Maintain technical expertise on advances in leadframe and interconnects; Address customer complaints with cross-functional teams
Seniority
Senior, hands-on IC
