Senior Manager, Package Design Engineering
Core
Lead package technology development and NPI execution for Renesas AI and data center infrastructure power products, including Smart Power Stages, Vertical Power Stages, Power Modules, and discrete FET packages.
Role type
Senior Manager, Package Design Engineering
Builds
Power SiP/modules, wafer-level packaging, flip-chip interconnects, advanced substrates, and emerging power-package technologies for automotive, industrial, infrastructure, and IoT applications.
Domain
Semiconductor packaging and power electronics
Required skills
Power SiP/modules expertise, wafer-level packaging, flip-chip packaging, package and product qualification, reliability methods, SPC, DOE, statistical analysis, cross-functional team leadership, global manufacturing partner management, risk assessment, production controls, technology transfer, yield improvement.
Preferred skills
Wire-bonding, multi-chip modules, SiC/GaN packaging, advanced substrates, project management, presentation skills.
Technologies
Smart Power Stages, Vertical Power Stages, Power Modules, discrete FET packages, DBC, AMB substrates, SiC, GaN, flip-chip, multi-chip modules (via careerplan.io/jobs/744000153263819-senior-manager-package-design-engineering-at-renesas-electronics)
Responsibilities
Lead package technology development and NPI execution; manage design and development of package and interconnect solutions; evaluate and qualify materials, processes, and assembly subcontractors; partner with OSATs to optimize assembly processes; coordinate with cross-functional teams to qualify new packages; drive resolution of package and process integration issues; define and implement production controls; ensure smooth technology transfer into production; lead technical response to customer concerns; establish package design rules and engineering standards.
Seniority
Senior, hands-on IC with management responsibilities