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Director, Package Quality and Reliability

Singapore, Singapore💼 Full-time🗓 2026-06-24 → 2026-09-25

Core

Lead execution of package reliability qualification, failure analysis, and continuous improvement for semiconductor packages across new product introductions and high-volume manufacturing.

Role type

Director, Package Quality & Reliability Engineering

Builds

Robust package quality and reliability performance for mobile, automotive, data center, and AI/HPC applications.

Domain

Semiconductor manufacturing and packaging

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor packaging technologies, package reliability test methodologies, failure analysis techniques, chip-to-package interaction analysis, thermo-mechanical stress understanding, qualification processes, risk assessment, people management, cross-functional collaboration

Preferred skills

Memory product experience (DRAM, NAND, HBM), advanced packaging technologies (SiP, hybrid bonding), automotive or AI/HPC reliability requirements, predictive reliability analytics, OSAT/supplier management, AI-enabled tools for data analysis

Technologies

JEDEC standards, AEC-Q standards, temperature cycling, HAST, MSL/preconditioning, board-level reliability, cross-sectioning, SAM, X-ray, SEM/EDX

Responsibilities

Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing; Identify and resolve key reliability risks including chip-to-package interaction and material-related failure mechanisms; Drive improvements in reliability test coverage and methodologies; Partner with Package Development Engineering to integrate Design for Reliability into package design; Lead and develop a team of engineers focused on package reliability and failure analysis; Provide technical input and recommendations for risk assessment and manufacturing excursions; Support failure analysis and root cause investigations using structured methodologies like 8D.

Seniority

Director, technical leadership and people management

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