PDE MRDA PROCSS ENGINEER
Core
Engineer in Package Development & Engineering (MRDA) responsible for process, equipment, and materials definition, development, and optimization to ensure Advance Packaging success.
Role type
Senior IC process engineer (semiconductor packaging)
Builds
Semiconductor memory and storage packages (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features
Required skills
Process flow analysis, defect anomaly identification, real-time data analysis, image classification model management, AI tool integration, yield improvement strategies, experimental design, supplier collaboration, global process alignment
Preferred skills
Experience with inline process signals, automated reporting systems, Best Known Methods (BKMs) development, technical paper writing
Technologies
AI-powered tools, image classification models, inline process monitoring systems, SWR (Special Work Request) systems
Responsibilities
Analyze experimental process flows to identify defect anomalies and quarantine out-of-control tools; Design and analyze SWRs to implement process changes for yield improvements; Reduce scrap and mitigate excursions by characterizing process responses; Collaborate with global teams to align Best Known Methods (BKMs) and optimize capacity; Leverage AI tools to enhance yield analysis and operational efficiency; Develop techniques to identify process issues and manage automated reporting systems.
Seniority
Senior, hands-on IC
