Engineer, APTD CEM - Advanced Packaging Equipment Engineering
Core
Develop and optimize advanced packaging equipment for wafer-level packaging and stacking to enable process improvements, reduce costs, and enhance productivity for memory and storage solutions.
Role type
Senior IC equipment engineering lead (advanced packaging)
Builds
Advanced packaging equipment and hardware strategic roadmaps for post probe wafer and die processing
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Equipment development, process optimization, equipment management, hardware strategy, data analysis, cross-functional collaboration, NPD to high-volume transition
Preferred skills
Semiconductor industry experience, Python, R, SQL, Visual Basic for automation, leadership track record
Technologies
Python, R, SQL, Visual Basic
Responsibilities
Develop and optimize advanced packaging equipment for technology enablement; Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing; Ensure defense coverage through process, measurement, inspection, and testing; Work with internal and external partners to build and execute technology development strategies; Ensure smooth transition from new product development to high volume production
Seniority
Senior, hands-on IC with strategic roadmap ownership
