Principal Package Design Engineer
Core
Lead the design, development, and qualification of next-generation advanced packaging solutions for high-performance semiconductors and electronic products.
Role type
Principal IC packaging engineer (advanced packaging)
Builds
High-performance semiconductor packages (Flip-chip, WLP, SiP, 2.5D/3D) for automotive, industrial, and AI/ML hardware
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Advanced packaging architecture design, thermal/mechanical reliability analysis, OSAT collaboration, failure analysis, DOE planning, cross-functional technical leadership
Preferred skills
Power semiconductor packaging (Si/SiC/GaN), chiplet-based heterogeneous integration, simulation tools (ANSYS, COMSOL, Cadence Allegro), JEDEC/IPC standards expertise
Technologies
ANSYS, COMSOL, Cadence Allegro Package Designer, JMP, Minitab
Responsibilities
Define package architecture based on electrical/thermal/mechanical requirements; lead qualification activities including failure analysis and reliability testing; develop assembly flows for OSATs; mentor junior engineers; resolve packaging issues during NPI and production ramp
Seniority
Principal, hands-on IC with strategic oversight