Staff Packaging Design Engineer封装开发工程师 （功率模块）
Core
Design and develop power modules using embedded die laminate technology with SMT for commercial industrial power devices serving servers and AI applications.
Role type
Staff Packaging Design Engineer (Power Modules)
Builds
Power modules for servers and AI power applications
Domain
Semiconductor packaging, power electronics, industrial and data center infrastructure
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Power module plastic package development, embedded die laminate technology, SMT processes, OSAT management, DOE execution, AutoCAD, statistical process control (SPC), statistical analysis, material selection, process qualification
Preferred skills
Roadmap development, technical innovation tracking, cross-functional collaboration with product designers and reliability teams
Technologies
AutoCAD, Excel, PowerPoint, Word, wire-bonding, flip chip, SMT
Responsibilities
Define package technologies tooling and qualification, benchmark and qualify materials/processes/subcontractors, develop detailed package drawings, run DOE to optimize processes, qualify new packages within schedule, maintain expertise on packaging innovations, participate in packaging roadmap execution
Seniority
Senior, hands-on IC
