Mechanical Simulation Engineer
Core
Develop high-fidelity Finite Element Analysis (FEA) models to predict and optimize the thermos-mechanical behavior of next-generation semiconductor packages (HBM, 2.5D/3D) for structural integrity and reliability.
Role type
Senior IC mechanical simulation engineer (semiconductor packaging)
Builds
Advanced packaging solutions for HBM, 2.5D/3D heterogeneous integration, and data center rack architectures
Domain
Semiconductor manufacturing / Advanced Packaging / Mechanical Engineering
Required skills
Non-linear FEA modeling, Thermo-mechanical multi-physics analysis, Material constitutive modeling, Failure mode prediction, System-level interaction analysis, Simulation workflow automation
Preferred skills
Multi-scale modeling, Python scripting for FEA automation, Statistical analysis (DOE), Semiconductor manufacturing process knowledge, CAD geometry preparation
Technologies
ABAQUS, ANSYS Mechanical, LS-DYNA, JMP, Minitab, NX, Solidworks, AutoCAD
Responsibilities
Develop high-fidelity non-linear FEA models to characterize stress, strain, and warpage; Perform complex thermo-mechanical simulations to evaluate thermal gradients; Partner with designers to optimize architectures for warpage control and solder joint reliability; Define and implement material constitutive models and correlate results with empirical data; Predict failure modes and develop mitigation strategies; Establish standardized simulation workflows and automation scripts; Present technical findings to stakeholders to influence product roadmaps; Evaluate thermo-mechanical interactions between packages and system-level components.
Seniority
Senior, hands-on IC
