Senior Design Engineer
Core
Lead complex thermal-mechanical simulation projects to influence package architecture, material selection, and reliability risk reduction for advanced semiconductor packages.
Role type
Senior FEA Modeling Engineer (Thermal-Mechanical)
Builds
High-fidelity FEA models and simulation workflows for advanced semiconductor packaging technologies.
Domain
Semiconductor manufacturing / Advanced Packaging / Thermal-Mechanical Engineering
Required skills
Thermal-mechanical FEA, Nonlinear material modeling, Temperature-dependent material modeling, Advanced packaging processes, Reliability testing correlation, Model validation, Cross-functional communication, Technical leadership, Workflow automation, Sensitivity analysis
Preferred skills
Coupled electro-thermal-mechanical modeling, Fracture mechanics, Cohesive-zone modeling, Viscoelasticity, Optimization, Surrogate modeling, Uncertainty quantification, Emerging integration technologies (HBM, hybrid bonding, chiplets), Advanced scripting (Python, MATLAB, APDL, TCL)
