Sr. Staff Thermo-Mechanical Engineer
Core
Sr. Staff Thermo-Mechanical Engineer ensuring mechanical robustness, dimensional stability, and long-term reliability of semiconductor test and validation infrastructure (sockets, thermal heads, handlers) for high-power XPU and Silicon Photonics programs.
Role type
Sr. Staff Thermo-Mechanical Engineer (Simulation & Reliability)
Builds
Mechanical simulation models, reliability predictions, and design constraints for semiconductor test infrastructure and package interfaces.
Domain
Semiconductor manufacturing, test infrastructure, and high-power hardware.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thermo-mechanical FEA, multi-physics modeling, warpage analysis, fatigue modeling, material behavior analysis, simulation-to-test correlation, root-cause analysis, technical leadership, cross-functional collaboration.
Preferred skills
Semiconductor packaging knowledge, process modeling, scripting/automation.
Technologies
ANSYS, Abaqus, COMSOL, Python, MATLAB.
Responsibilities
Perform advanced thermo-mechanical FEA for stress/strain/deformation; Lead warpage and deformation analysis for multi-material assemblies; Develop thermal cycling and mechanical fatigue models; Create process-aware mechanical models; Correlate simulation results with physical testing and metrology; Identify mechanical risk drivers and recommend design changes; Support root-cause analysis of mechanical failures; Develop simulation methodologies and guidelines; Partner with thermal, packaging, test, and manufacturing teams.
Seniority
Sr. Staff, hands-on IC with technical leadership.
